Compute
Servers, CPU and memory platforms, general-purpose accelerators, server networking, and lifecycle — plus the compute side of the 3-tier vs HCI choice.
What it is
Compute is the server itself: form factor, CPU and memory platform, local boot and drives, general-purpose accelerators, the NICs and how the host attaches to the fabric, and the firmware, warranty and retirement lifecycle. It also owns the compute side of the platform choice: 3-tier (servers plus external storage) or HCI.
HCI models and cluster design are on HCI. External arrays and storage networking are on Storage. GPU systems built as an AI factory, and their power, liquid and back-end fabric, are on AI Factory. The fabric the servers plug into is on Network: Fabric design. Cabinets are on Racks.
Key tech subclasses
General servers
1U–4U rackmount, multi-node systems, blade / modular chassis, 4-socket scale-up. Server ladders →
Platform choice
3-tier vs HCI from the server’s point of view, and the hypervisor licence metric that turns core count into a cost decision. HCI models are on HCI. Platform choice →
Accelerators
Inference and graphics cards in general-purpose servers. Sharing models: passthrough, time-sliced vGPU, and MIG where the card supports it (not L4 or L40S). vGPU needs a separate NVIDIA software licence. GPU training systems are on AI Factory.
Server networking
NIC speed and count, host bonding and LACP vs switch-independent teaming, DPU/SmartNIC, and the BMC port. Server networking →
Lifecycle
BMC automation through Redfish (IPMI-over-LAN is legacy), bare-metal provisioning, BIOS/BMC/NIC/DPU/drive firmware baselines, warranty and support, sanitization to NIST SP 800-88 Rev. 2.
Design / build / manage
Design
- Match form factor to the rack power and cooling budget on Power and Cooling
- Choose 3-tier or HCI on purpose (Platform choice), and model hypervisor licence cost against core count before picking the CPU SKU
- Size NIC speed to the leaf port and the storage path, and pick a teaming mode the hypervisor supports with the fabric’s dual-homing model (Server networking)
- Standardize the BOM and the BMC credentials model (Security: BMCs)
- GPU training racks: plan on AI Factory, not here
Build
- Image golden templates; enable secure boot where required
- Automate provisioning through Redfish; disable IPMI-over-LAN where the BMC allows
- Apply an OEM-validated firmware baseline as a set: BIOS, BMC, NIC, DPU, drives, GPU
- Cable each host to two leaves through two adapters, and test failover with one leaf down
- Document serials and rack elevations in DCIM
Manage
- Re-baseline firmware on a controlled cadence through Redfish
- Monitor thermals, power caps, and accelerator health
- Track warranty end and spares against the refresh plan
- Sanitize retired media to NIST SP 800-88 Rev. 2; for self-encrypting drives, cryptographic erase with a certificate
Related comparisons
Sections on this page and the pages that hold the detail.
Platform choice: 3-tier vs HCI
What the platform choice changes for the server: form factor, hardware freedom, firmware ownership, and licensing. The HCI vs 3-tier comparison, HCI models, cluster sizing and HCI networking are on HCI. External arrays and storage networking are on Storage. Licensing terms change often; recheck this section about every 6 months. No pricing. Sources checked 5–6 Oct 2026.
From the server’s point of view
The HCI, dHCI and 3-tier comparison and decision table are on HCI: HCI vs 3-tier. This section keeps only what the choice changes for the server.
Form factor and hardware freedom. 3-tier hosts need boot media only, so 1U is viable: on the same Dell 16G sheet, the 1U R660 takes 10 × 2.5 in drives and the 2U R760 takes 24 (ladder below). Any server and NIC on the hypervisor’s compatibility list will do. HCI nodes carry capacity drives and must come from the HCI vendor’s certified node or component list, which narrows CPU, NIC, controller and drive choice.
Firmware ownership. In 3-tier you own the server firmware baseline and must keep it inside both the hypervisor HCL and the array’s support matrix. In HCI the vendor’s lifecycle manager usually applies firmware, drivers and hypervisor as one validated bundle, so the server baseline is no longer yours to set.
Hypervisor licence metrics
Compare hypervisors by licence metric and lifecycle here; features and HCI-bundled hypervisors are on HCI. The metric decides whether core count is a performance choice or a cost choice.
| Hypervisor family | Licence metric | Minimums and notes | Sources |
|---|---|---|---|
| VMware vSphere (VCF / VVF) | Per physical core, subscription | Minimum of 16 cores counted per CPU. vSAN capacity entitlement per core is on HCI: Licensing basis. Trade press reports a per-order core minimum introduced in 2025. | Broadcom KB 313548 |
| Hyper-V (Windows Server 2025) | Per physical core | At least 8 core licences per processor and 16 per server. Standard covers 2 OSEs; Datacenter covers unlimited OSEs when all physical cores are licensed. A per-VM option exists (minimum 8 cores per VM, subscription or SA only). | Microsoft licensing guidance |
| KVM: Proxmox VE | Software free to use; optional support subscription per occupied CPU socket | Proxmox states core count does not affect the subscription price | Proxmox VE subscriptions |
| Other KVM platforms (OpenShift Virtualization, OpenStack distributions, Nutanix AHV) | Varies by distribution | Not researched for this page. AHV is covered with Nutanix on HCI. | — |
Core count is a licence decision. Under per-core metrics, a socket with many cores costs proportionally more to license than one at the per-CPU minimum, while per-socket subscriptions do not change with cores. Model licence cost per host against core count and VM density before choosing the CPU SKU. Fewer, larger hosts also raise the share of capacity held back for HA. (Derived from the metrics above.)
Platform choice design / build / manage
Design
- Make the HCI vs 3-tier decision on HCI, then apply its server-side consequences here
- Model licence cost against core count per host for each candidate hypervisor
- For HCI, pick server models from the vendor’s certified list before fixing CPU, NIC and drives
Build
- Record which interoperability matrix governs each host: hypervisor HCL, array matrix, or HCI bundle
Manage
- Recheck licence terms at each renewal and before each refresh; they change faster than hardware
Server networking
The host side of the server-to-leaf link. Leaf port speeds, oversubscription and ECMP are on Network: Fabric design. Dual-homing on the switch side (MLAG/vPC vs EVPN ESI multihoming) is on Network: multihoming, and the tenant and underlay MTU on Network: MTU. Transceivers and cables are on Network: Optics. Storage networking is on Storage; HCI cluster traffic and RDMA on HCI; AI back-end NICs on AI Factory. NIC and DPU generations change every 12 to 24 months; recheck about every 6 months. Sources checked 5–6 Oct 2026.
What compute decides and what the fabric decides
| Topic | Compute decides (this page) | Fabric decides (link) |
|---|---|---|
| Speed | NIC model and speed, OCP or PCIe card, which slot and PCIe generation | Leaf downlink speed and the uplink ratio (Fabric design) |
| Count | Adapters and ports per host, and which traffic uses which | Leaf ports per rack; switch placement (Racks: switch placement) |
| Dual-homing | Host teaming mode: LACP, static, or switch-independent | MLAG/vPC or EVPN all-active (ESI), and the leaf-side LAG (Network: multihoming vs MLAG) |
| MTU and VLANs | Set host vNIC and VMkernel/vEthernet MTU to the agreed tenant MTU; tag the agreed VLANs on the host trunk | Tenant and underlay MTU, VLAN-to-VNI mapping (Network: MTU) |
| Media | NIC cage type (SFP, QSFP, OSFP), and a NIC that accepts the chosen module or cable | DAC, active copper, AOC or optics per link length (Optics: DAC, active copper, AOC) |
| Management | BMC on a dedicated port or shared with a host NIC | The OOB network (Network: OOB); BMC hardening on Security: BMCs |
NIC speed
Follow the leaf. The NIC speed is the leaf downlink speed chosen on Fabric design; a faster NIC than the leaf port buys nothing, and a slower one strands leaf capacity. Current 1U/2U OEM servers offer 1, 10, 25, 100 and 400GbE options on OCP NIC 3.0 slots (Dell R670 spec sheet). The OCP NIC 3.0 specification is at version 1.6.0 (31 Mar 2025) and defines SFF, TSFF, LFF and DSFF card sizes (OCP NIC 3.0).
Check the slot, not just the port. PCIe 5.0 signals at 32.0 GT/s per lane and PCIe 6.0 at 64.0 GT/s (PCI-SIG, PCIe 6.0). A Gen5 x16 slot therefore carries roughly 500 Gb/s per direction before protocol overhead: enough for one 400G port or two 200G ports at line rate, not two 400G ports. A dual-port 400G card needs a Gen6 x16 slot (or two Gen5 x16 links) to run both ports at line rate. Dual-port NICs used for redundancy, not throughput, are not limited by this.
| Host role | Common starting point | Moves up when |
|---|---|---|
| General VM host, FC or separate storage path | 2 × 25GbE | VM east-west traffic or live migration windows saturate the pair |
| VM host carrying IP storage on the same ports (iSCSI, NVMe/TCP, NFS) | 2 × 100GbE, or 2 × 25GbE plus dedicated storage ports | Storage and migration bursts compete with VM traffic |
| HCI node | See HCI | Replication and resync traffic sets the floor |
| Sources | Practice, not a standard. Microsoft’s converged example shows the split on a teamed 2 × 25GbE pair: 25 Gbps for SMB storage and 7.25 Gbps for live migration (Azure Local host network requirements, doc dated 15 Jan 2026). | |
NIC count and traffic separation
Two adapters, two leaves. Use two physical adapters with one port from each to each leaf, so neither a card nor a leaf is a single point of failure. Two ports on one card protect against a leaf or cable failure, not a card failure.
Converged or dedicated. Converged designs run every traffic class on one teamed pair, separated by VLAN and QoS or DCB. Microsoft documents a converged Switch Embedded Teaming design with DCB reserving 50% for SMB, and states this is “an example and not a support requirement” (Azure Local). Dedicated designs add ports for storage or migration, at the cost of more leaf ports and cables. The storage side of that choice is on Storage.
Storage multipath is not a LAG. IP storage multipathing (iSCSI MPIO, NVMe multipath) expects one path per adapter, usually on its own subnet or VLAN. Microsoft’s example keeps each storage adapter on its own subnet so traffic stays on its own leaf and off the MC-LAG peer link (Azure Local). Broadcom states that LACP is not compatible with software iSCSI multipathing, and that iSCSI multipathing should not run over static EtherChannel or LACP bonds (Broadcom KB 315347).
Host bonding and LACP
The host can run LACP (802.3ad/802.1AX), a static LAG, or switch-independent teaming. Which modes exist depends on the hypervisor and its virtual switch, not on the NIC.
| Host platform | Switch-independent options | LAG options | Constraints | Sources |
|---|---|---|---|---|
| vSphere Standard Switch | Route based on originating virtual port (default), source MAC hash; active/standby | Static EtherChannel with “Route based on IP hash”. No LACP. | No beacon probing with IP hash | Broadcom KB 324555 · KB 324490 |
| vSphere Distributed Switch | As above, plus route based on physical NIC load (load-based teaming) | LACP LAGs: up to 64 per distributed switch and per host | Needs vCenter and a licence tier that includes the distributed switch. LACP is not supported with SR-IOV or software iSCSI multipathing, is absent from host profiles, and does not work with the ESXi dump collector (keep that VMkernel port on a standard switch). | Broadcom KB 315347 · vSphere 8 teaming |
| Hyper-V / Azure Local (SET) | Switch-independent only: Hyper-V Port (recommended at 10 Gbps and above) or Dynamic | None. LBFO teaming is not supported on Azure Local. | Up to 8 adapters per team; members must match in make, model, speed and configuration | Azure Local host network requirements |
| Linux bonding (KVM, Proxmox VE) | Mode 1 active-backup; modes 5 and 6 (balance-tlb, balance-alb). None needs switch configuration. | Mode 4 (802.3ad) needs an 802.3ad-capable switch and members at the same speed and duplex; mode 0/2 static | The layer3+4 transmit hash is “not fully 802.3ad compliant” | Linux kernel bonding |
LACP needs one partner. A host LAG across two leaves works only if the host sees a single LACP partner on both links and bonds them as one aggregate. Making two leaves look like one partner is the switch side’s job (Network: multihoming and LACP). Broadcom’s wording is that ESXi supports teaming to “a single physical switch or stacked switches” (KB 324555).
Choosing. LACP gives per-flow hashing across both links and fast detection of a mis-cabled or unidirectional member, but ties host and leaf configuration together and needs leaf-side LAGs for every host. Switch-independent teaming needs nothing on the leaf: each leaf port is an ordinary access or trunk port, and each vNIC is pinned to one uplink. Under SET it is the only choice; under vSphere it avoids the distributed-switch and LACP limits above. In either model a single flow never exceeds one link’s speed.
What switch-independent teaming does to the fabric. On failover, the vNIC’s MAC moves to the other leaf.
- On an MLAG/vPC pair the move stays inside the pair, behind its shared VTEP IP, and is not an EVPN MAC move. But the host ports are orphan (single-homed) ports on the pair, so traffic can cross the peer link (Network: multihoming).
- On ESI or single-homed leaves the move is an EVPN MAC Mobility event. Repeated flaps can trip EVPN duplicate-MAC detection, after which the fabric stops advertising that MAC (Network: service insertion).
- The hypervisor must announce the move (vSphere “Notify switches”, or RARP/gratuitous ARP from the virtual switch). Without it, traffic to that MAC blackholes until the old entry ages out.
Provisioning before the bond exists. A host that PXE-boots, or a freshly installed hypervisor, does not yet speak LACP. If the leaf requires LACP, the port stays down. Use the switch’s LACP fallback or bypass for provisioning ports, or provision on a switch-independent setup and convert later. During bypass the host must bring up only one member, or keep provisioning traffic on one link, to avoid loops or duplicate frames. Cumulus documents LACP bypass on EVPN-MH bonds and stops advertising the segment’s Type 1 and Type 4 routes while in bypass (Cumulus EVPN-MH).
DPU / SmartNIC
Vendors use “SmartNIC”, “DPU” and “IPU” loosely. This page uses three categories by what runs on the card.
| Category | What it does | Fit | Cost of ownership |
|---|---|---|---|
| Standard NIC | Stateless offloads (checksum, TSO/LSO, RSS), SR-IOV, often RoCE | VLAN-backed VM hosts; most 3-tier estates | Driver and firmware in the host baseline |
| Offload NIC (fixed-function SmartNIC) | Adds overlay (VXLAN/Geneve) encap offload, flow tables, crypto, NVMe/TCP or RDMA acceleration | Hosts running an overlay or IP storage at high rates | Feature support depends on the hypervisor driver |
| DPU / IPU (programmable, own cores and OS) | Runs virtual switching, distributed firewall, storage initiator or telemetry on the card, isolated from the host OS. Examples: NVIDIA BlueField-3, a 400 Gb/s platform for software-defined networking, storage and security; AMD Pensando Elba and Giglio (P4-programmable, dual 200 Gb/s) and Salina (400G class). | Hosts running an NSX-style distributed firewall or overlay, or storage offload, where host CPU cores are licensed per core | A second OS to patch and track in the firmware baseline. Supported only on specific hypervisor, DPU and server combinations. Adds power and uses a slot. |
| Sources | NVIDIA DPU · AMD Pensando · categories and trade-offs are synthesis | ||
Value is highest where the DPU takes work off licensed host cores (overlay, firewall, storage initiator), and lowest on plain VLAN-backed VM hosts. Before buying, confirm the hypervisor release supports that exact DPU in that exact server. AI SuperNICs are on AI Factory; RDMA for HCI on HCI.
BMC port
Most rack servers let the BMC use either a dedicated management port or a shared host NIC port with a VLAN. Dell’s iDRAC 10 documentation describes the dedicated port as “not shared with the host operating system” and separated from application traffic; shared LOM saves a cable and can fail over to a second LOM port (Dell KB 000374138, modified 26 Mar 2026). A shared port puts the BMC behind the production NIC and leaf, so it is not reachable when that path is down, which defeats the purpose of the OOB network. Cable the dedicated BMC port to the OOB network (Network: OOB), and harden it as on Security: BMCs. Automate through Redfish, DMTF’s current management API (release 2026.2, 14 Sep 2026) (DMTF Redfish).
Server networking design / build / manage
Design
- Take the NIC speed from the leaf downlink speed (fabric design) and check the PCIe slot can carry it
- Specify two adapters per host and decide converged or dedicated storage ports with Storage
- Pick a teaming mode the hypervisor supports and agree it with the fabric’s dual-homing model (multihoming)
- Keep storage multipath on separate paths, not in a LAG
- Buy a DPU only for a named offload on a supported hypervisor, DPU and server combination
Build
- Set host MTU to the agreed tenant MTU and test end to end with DF set
- Configure LACP fallback or a switch-independent build profile for provisioning ports
- Cable the dedicated BMC port to the OOB network
- Fail each leaf and each adapter in turn and confirm VM, storage and management traffic survive
Manage
- Keep NIC and DPU firmware and drivers in the host baseline and update them as a set
- Watch per-member link errors and LACP state; a silently down member halves capacity
- Recheck teaming and LACP limits after every hypervisor major release
Products in Compute
Market leaders & comparison
No current Gartner Magic Quadrant for modular/rack servers (Modular Servers MQ retired ~2017). Shortlist below uses IDC OEM server market presence (2025 trade coverage). Positions are market-cited, not invented MQ ranks. HCI market placements are on HCI: market.
See full example → Compute Rival Snapshot
| Vendor / product | Strengths | Typical fit | Caveats | Sources |
|---|---|---|---|---|
| Dell PowerEdge IDC OEM leader | Deep SKU coverage, iDRAC/OpenManage, strong GPU server lineup | General enterprise, virtualization, AI racks with Dell networking/storage | Configure carefully for power/cooling envelope | IDC server market summaries via Network World 2025 |
| HPE ProLiant / Synergy IDC top OEM | GreenLake consumption, composable Synergy, ILO lifecycle | Composable private cloud, HPE Alletra adjacency | Portfolio breadth can complicate BOM standards | IDC 2025 OEM rankings (trade press) |
| Lenovo ThinkSystem IDC top OEM | Strong x86 value, HPC/AI (Neptune liquid), ThinkAgile HCI | Cost-optimized fleets, HPC, dense GPU | Validate regional support SLAs | IDC 2025 OEM rankings (trade press) |
| Cisco UCS / X-Series Widely cited | Fabric-integrated compute, Intersight ops, tight Nexus adjacency | Cisco-standardized DCs, blade/X-Series refreshes | Less common as pure price leader vs Dell/Lenovo | Cisco public UCS/X-Series materials |
| Supermicro IDC OEM share | Fast GPU/AI SKUs, building-block flexibility, density | AI training/inference racks, custom configs | Enterprise support/standardization varies by region/partner | IDC 2025 OEM share coverage |
Dell PowerEdge 16G — within-vendor rack ladder (prior generation)
From the Dell PowerEdge rack quick-reference PDF fetched 3 Oct 2026 (poweredge-rack-quick-reference-guide.pdf). Processor generation on that sheet is 4th Gen Intel Xeon Scalable or 4th Gen AMD EPYC 9004 — not a newer generation. Dell also publishes 17G spec sheets on Intel Xeon 6 and AMD EPYC 9005 (R770, R670, R7725, R6725); a 17G table is not yet on this page. Rack height is the sheet’s “Rack height (U)” row. No list prices. Planning watts already on Catalog lines are not from this PDF.
| Model | RU | CPU (sheet) | Memory | Drives / accel (up to) |
|---|---|---|---|---|
| R760 | 2U | 2× 4th Gen Xeon Scalable, up to 56 cores | 32 DDR5 (8 TB) | 24× 2.5 in or 12× 3.5 in; 2× 350 W DW or 6× 75 W SW |
| R660 | 1U | Same 2× 4th Gen Xeon class | 32 DDR5 (8 TB) | 10× 2.5 in; 2× 75 W SW (sheet footnote: more GPU slots in a future release). R660 spec sheet height 42.8 mm (1.68 in). |
| R7625 | 2U | 2× EPYC 9004, up to 96 cores | 24 DDR5 (1.5 TB*) | 24× 2.5 in; 2× 300 W DW or 6× 75 W SW |
| R6625 | 1U | 2× EPYC 9004, up to 96 cores | 24 DDR5 (1.5 TB*) | 10× 2.5 in; 3× 75 W SW |
| R7615 | 2U | 1× EPYC 9004, up to 96 cores | 12 DDR5 (768 GB*) | 24× 2.5 in; 3× 300 W DW or 6× 75 W SW |
| R6615 | 1U | 1× EPYC 9004, up to 96 cores | 12 DDR5 (768 GB*) | 10× 2.5 in; 3× 75 W SW |
Catalog places R760 on the 2U line and R660 on the 1U line. AMD siblings above are the same sheet; they are not extra Configure SKUs on the Intel lines.
HPE ProLiant — Gen12 rack ladder (current)
Gen12 is the current public generation for mainstream Intel rack and single-socket AMD: DL320, DL325, DL340, DL345, DL360, DL380, and 4-socket DL580 Gen12. Specs below are only what was read in an HPE datasheet (PSN) or QuickSpecs. Where a datasheet’s overview and its technical-specifications table disagree, the overview is quoted and the table is flagged — not silently “fixed.” No list prices. No watts: these PDFs were not used to set Catalog planning watts, and no watt was invented for a new line. Advisor role is a buyer shortlist label, not an HPE claim. No DL365 Gen12, DL385 Gen12, or DL560 Gen12 document was found (search miss, not an HPE retirement notice).
| Model | Form factor | CPU (datasheet) | Memory | Drives (as stated) | Advisor role |
|---|---|---|---|---|---|
| HPE ProLiant Compute DL320 Gen12 | 1U rack | 1 processor. Intel Xeon 6. 8 to 144 cores, depending on processor. | 4.0 TB with 256 GB DDR5. 16 DIMM slots. (An indexed HTML widget says up to 2 TB and 8 DIMM channels; this row follows datasheet PSN1014835186WWEN.) | Up to 8+2 SFF SAS/SATA or SATA/SAS/NVMe U.2 or U.3; up to 12 LFF SAS/SATA; up to 20 EDSFF E3.S 1T; optional RAID 1 NVMe M.2 boot. All depending on model. | Entry 1U single-socket Intel |
| HPE ProLiant Compute DL325 Gen12 | 1U rack | 1 processor. 5th Generation AMD EPYC. 8 to 192 cores, depending on processor. | 6.0 TB with 256 GB DDR5. 24 DDR5 DIMM slots. | Up to 4 LFF SAS/SATA, 10 SFF SAS/SATA/NVMe, or 20 EDSFF NVMe, depending on model. | Entry 1U single-socket AMD |
| HPE ProLiant Compute DL340 Gen12 | 2U rack | 1 processor. Intel Xeon 6. 8 to 144 cores, depending on processor. | 4.0 TB with 256 GB DDR5. 16 DIMM slots. | Datasheet: up to 12 LFF SAS/SATA, up to 24 SFF SAS/SATA/NVMe, up to 36 EDSFF, depending on chassis and configuration. Indexed HTML bullets say “up to 20× EDSFF or 8× SFF or 12× LFF” — not reconciled. This row follows the datasheet. | 2U single-socket Intel, more drive and I/O room than the DL320 |
| HPE ProLiant Compute DL345 Gen12 | 2U rack | 1 processor. 5th Generation AMD EPYC. 8 to 192 cores, depending on processor. | 6.0 TB with 256 GB DDR5. 24 DDR5 DIMM slots. | Up to 12 LFF SAS/SATA, 24 SFF SAS/SATA/NVMe, or 36 EDSFF NVMe, depending on model. | 2U single-socket AMD, storage-heavier than the DL325 |
| HPE ProLiant Compute DL360 Gen12 | 1U rack | 1 or 2 processors. Intel Xeon 6 Scalable. 8 to 144 cores, depending on processor. Features text: 16 DIMM channels per processor. | 8 TB with 256 GB DDR5. 32 DDR5 DIMM slots (16 per processor). | Up to 4 LFF SAS/SATA; up to 8+2 SFF SAS/SATA or U.3 NVMe; up to 10 SFF / 20 E3.S mixed; optional OS boot device. Overview also says 20 EDSFF E3.S NVMe. | Mainstream dense 1U dual-socket Intel |
| HPE ProLiant Compute DL380 Gen12 | 2U rack | 1 or 2 processors. Intel Xeon 6 Scalable. 8 to 144 cores, depending on processor. Features text: 16 DIMM channels per processor. | 8 TB with 256 GB DDR5. Spec table: 32 DIMM slots. | Overview, not the spec table. What’s New / overview: up to 36 EDSFF E3.S NVMe; up to 3 double-wide or 8 single-wide GPUs. The same PDF’s technical-specifications table lists a different matrix (8 or 12 LFF; 8, 16, or 24 SFF; optional rear SFF; “20 SFF NVMe”) and names Intel Optane Persistent Memory. Those table lines conflict with the overview. | Mainstream 2U dual-socket Intel |
| HPE ProLiant Compute DL580 Gen12 | 4U. Overview: four-socket server in a 4U chassis. What’s New repeats 4U. | 2 to 4 processors. Intel Xeon 6. 8 to 86 cores, depending on processor. Features text ties “up to 86 cores” to 16 DIMM channels per processor, so 86 is per processor, not a 4-socket total. | 16 TB with 256 GB DDR5. 64 DIMM slots. | Spec table: up to 32 SFF/EDSFF NVMe, depending on configuration. Overview also: up to 32 SFF or 32 EDSFF E3.S, plus an OS boot device in the front cage. | 4-socket scale-up. Gen12’s 4-socket server is this 4U DL580, not a 2U DL560. |
Reading notes: the DL360, DL380 and DL580 Gen12 “16 DIMM channels per processor” Features text matches 16 DIMM slots per processor in the same rows. Xeon 6700P-class platforms are reported to have 8 memory channels, so that is 2 DIMMs per channel, which usually lowers the supported memory speed against 1 DIMM per channel; check the OEM population guide. Intel Optane Persistent Memory named in the DL380 spec tables is discontinued and is not a current-generation option.
Gen12 sources read (HPE PSN datasheets; mirrors, because hpe.com/psnow timed out): DL320 PSN1014835186WWEN (23 Jun 2025); DL325 PSN1014896093DEEN (5 Feb 2026); DL340 PSN1014835192WWEN (23 Jun 2025); DL345 PSN1014896097USEN (28 Jul 2025); DL360 PSN1014865649BEEN (28 May 2025); DL380 PSN1014865653DEEN (5 Feb 2026); DL580 PSN1014891571DEEN (5 Feb 2026). Product pages (search-confirmed; HTML not fully fetched): DL320, DL325, DL340, DL345, DL360, DL380, DL580.
HPE ProLiant — Gen11 still published
Gen11 stays on the ladder. Dual-socket AMD is still Gen11 (DL365 QuickSpecs revised 26 Mar 2026; no DL365 Gen12 found). The 2U 4-socket role is still DL560 Gen11; Gen12’s 4-socket server is the 4U DL580, not a DL560. A prior pass that quoted only DL360/DL380 Gen11 from QuickSpecs a50004306enw / a50004307enw understated this. Those two QuickSpecs were not the documents used below. DL380 Gen11 and DL385 Gen11 are called out where the read document is old or contradicts itself.
| Model | Form factor | CPU (document) | Memory | Drives (as stated) | Advisor role |
|---|---|---|---|---|---|
| HPE ProLiant DL360 Gen11 | 1U 2P (overview). No separate “Form factor” field in the spec table. | 1 or 2. 4th Gen and 5th Gen Intel Xeon Scalable. 8 to 64 cores, depending on processor. | Overview: 8 TB. Spec table: 4.0 TB per socket with 256 GB DDR5. 16 DIMM slots per socket. | Up to 4 LFF SAS/SATA HDD or SSD; up to 8+2 SFF SAS/SATA or U.3 NVMe, depending on model; up to 20 EDSFF E3.S 1T NVMe SSD; up to 2 RAID1 NVMe M.2 boot devices. | Prior-gen dense 1U dual-socket Intel. Cite this when matching installed Gen11, not as the current gen. |
| HPE ProLiant DL365 Gen11 | 1U rack. QuickSpecs: rack-optimized 1U 2P. Up to 2 processors. | 4th and 5th Generation AMD EPYC, up to 160 cores. 12 DIMM channels per processor. | Up to 6 TB total DDR5. 5th Gen note in the 26 Mar 2026 QuickSpecs: 6400 MT/s. 96 GB, 128 GB, and 256 GB DDR5 RDIMMs are supported. | CTO servers called out include 8 SFF, 20 EDSFF, and GPU. Front-view note: optional +2 SFF (total max 10 SFF). 20 EDSFF drive bay. GPU note: 2 single-width or 2 double-width with 8 EDSFF or 4 SFF U.3 NVMe. | Current public AMD dual-socket 1U. No DL365 Gen12 was found. |
| HPE ProLiant DL380 Gen11 | 2U rack. Overview: scalable 2U 2P. | Use What’s New, not the spec table, for cores. 1 or 2. What’s New: 4th and 5th Gen Intel Xeon Scalable, up to 64 cores at 350 W. The spec table on the same PDF says “16 to 60 core, depending on processor.” That 16–60 line conflicts. | What’s New and overview: up to 8 TB DDR5. Spec table: 8 TB with 256 GB DDR5, 32 DIMM slots. What’s New also says “16 DIMMs” and “16 DIMM channels per processor.” Slot wording conflicts; quote 8 TB and the table’s 32 slots, with that conflict noted. | Overview: 20 EDSFF. What’s New: up to eight single-wide or three double-wide GPUs. The spec table drive line is a different list (8 or 12 LFF; 8, 16, or 24 SFF; optional rear SFF; 20 SFF NVMe) and mentions Intel Optane Persistent Memory. Same class of table-vs-overview conflict as the Gen12 DL380 datasheet. | Prior-gen mainstream 2U dual-socket Intel |
| HPE ProLiant DL385 Gen11 | 2U rack (QuickSpecs). | Low confidence that these maxima are still current. The only QuickSpecs retrieved is dated 18 Dec 2022 and says 4th Generation AMD EPYC 9004, up to 96 cores, 12 DIMM channels per processor. It does not mention 5th Gen EPYC. A 2025–2026 revision was not retrieved. Do not treat 96 cores as the 2026 maximum. | That 2022 QuickSpecs overview says up to 6 TB. Memory notes in the same revision say 6.0 TB and 256 GB RDIMM “will be available by Q1 2023.” DIMM slots available: 24 (12 per processor). Not re-verified for 2026. | Overview: Gen5 EDSFF and a chassis supporting 8 single-wide or 4 double-wide GPUs, with a note that EDSFF and the new GPU offering “will be available in Q1 2023.” Front view shows three optional 8-SFF U.3 bays. Current bay maximum not re-verified. Do not quote those GPU maxima as 2026 fact. | AMD dual-socket 2U rung. Keep the model; do not lock a 2026 config to the Dec 2022 sheet. |
| HPE ProLiant DL560 Gen11 | 2U chassis (overview). No “Form factor” row in the spec table. EMEA product page tech spec, as indexed: 2U rack. | 2 or 4. 4th Generation Intel Xeon Scalable only, in both the Jan 2024 datasheet and the indexed EMEA product page. 8 to 60 cores, depending on processor. What’s New: up to 60 cores at 350 W and 8 DIMM channels per processor. 5th Gen Xeon: not stated. | 16 TB with 256 GB DDR5. 64 DIMM slots. Overview: up to 16 TB DDR5. | Spec table: 8, 16, or 24 SFF SAS/SATA/SSD/NVMe, depending on configuration. Overview: up to six PCIe 5.0 slots and up to 2 OCP slots. | Prior-gen 4-socket, and it is 2U. Gen12 did not replace it with a DL560. |
Gen11 sources read: DL360 datasheet PSN1014696065WWEN (31 Oct 2024); DL365 QuickSpecs a50004299enw (PDF creation 26 Mar 2026); DL380 datasheet PSN1014696069SGEN (12 Feb 2026); DL385 QuickSpecs a50004300enw (18 Dec 2022) — low confidence on current maxima; DL560 datasheet PSN1014705735USEN (25 Jan 2024) — medium: no later datasheet was read; indexed product page still describes 4th Gen only. Product pages: DL360, DL365, DL380, DL385, DL560. Not given a row (indexed, specs not read): DL320/DL325/DL345 Gen11, DL380a Gen12. Catalog Configure lists datasheet drive classes only — no processor part numbers and no watt deltas.
HCI vendors and their market placements are on HCI: market; the compute side of the choice is in Platform choice.
Sources
Sources for the Platform choice and Server networking sections, checked 5–6 Oct 2026. OEM server sources for the ladders are listed under each table above. Research notes with per-claim detail are kept with the site source.
| Source | Type | Used for |
|---|---|---|
| PCI-SIG specifications · PCIe 6.0 | Primary (standards body) | PCIe 5.0 and 6.0 signalling rates |
| OCP NIC 3.0 | Primary (standards body) | OCP NIC 3.0 version and form factors |
| DMTF Redfish | Primary (standards body) | Redfish current release |
| NIST SP 800-88 Rev. 2 (Sep 2025) | Primary (standards body) | Media sanitization |
| Linux kernel bonding documentation | Primary | Linux bonding modes and hashing |
| Broadcom KB 324555 · KB 324490 · KB 315347 | Vendor (hypervisor) | ESXi link aggregation requirements and LACP limits |
| Broadcom KB 313548 | Vendor (hypervisor) | VCF/VVF per-core licensing and vSAN entitlement |
| vSphere 8 teaming and failover | Vendor (search summary; page redirects) | vSphere teaming policy names |
| Azure Local host network requirements (15 Jan 2026) | Vendor (hypervisor) | SET, converged example, storage subnets |
| Windows Server 2025 licensing guidance | Vendor (hypervisor) | Per-core licensing minimums |
| Proxmox VE subscriptions | Vendor (hypervisor) | Per-socket subscription metric |
| NVIDIA Cumulus Linux EVPN multihoming | Vendor (NOS) | LACP bypass during provisioning |
| Dell PowerEdge R670 spec sheet | OEM datasheet | Server NIC speed options |
| Dell KB 000374138 (26 Mar 2026) | OEM documentation | Dedicated vs shared BMC port |
| NVIDIA DPU · AMD Pensando | Vendor product pages | DPU examples |
| NVIDIA L4 · L40S · RTX PRO 6000 Server Edition | Vendor product pages | MIG support by card |